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제품 상세 정보:
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| 서버 유형: | 2U 랙 서버 | 프로세서: | 2개 또는 4개의 3세대 Intel® Xeon® 확장 가능 프로세서 |
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| 칩셋: | 인텔 C621A | 메모리: | 48개의 DDR4 DIMMs, 최대 3,200MT/s; 24개의 Optane™ PMem 200 시리즈, 최대 2,666MT/s. |
| 로컬 스토리지: | 25 x 2.5인치 전면 SAS/SATA 드라이브 | 팬 모듈: | N+1 중복 모드의 핫스왑 가능 팬 모듈 6개 |
Fusion 2488H V6 Rack Server
Mission-critical ServersStable and Reliable |
FusionServer 2488H V6 is the latest 2U 4-socket rack server. Itis ideal for computing- intensive scenarios, such as coud computing.vitualization, HPC, databases, and SAP HANA. Compared with two 2U 2-socket rack servers, the 2488H V6 saves more OPEX in virualizationSenarios It is configured with four 3rd Intele Xeon Scalable processors and supports up to 48 DDR4 DIMMss, 11 PCle slots and a maximumof 25 x 2.5-inch drives for local storage. Itincorporates patented technologies, such as DEMT and FDM, and integrates FusionDirectorsoftware for entire-lifecycle management, helping customers drive down OPEX and improve ROI.
| Server Type | 2U rack server |
| Processors | Two or four 3rd Gen Intel® Xeon® scalable processors (5300/6300/8300 series), TDP up to 250 W |
| Chipset | Intel C621A |
| Memory | 48 DDR4 DIMMss, up to 3,200 MT/s; 24 Optane™ PMem 200 series, up to 2,666 MT/s. |
| Local Storage | Supports various drive configurations and hot swappable: • 8 x 2.5-inch front SAS/SATA/NVME drives • 24 x 2.5-inch front SAS/SATA drives • 25 x 2.5-inch front SAS/SATA drives • 4 x 2.5-inch front SAS/SATA drives and 8 x NVMe SSDs • 4 x 2.5-inch front SAS/SATA drives and 16 x NVMe SSDs Supports flash storage: • Dual M.2 SSDs |
| RAID Support | Supports RAID 0, 1,10, 5, 50, 6, or 60, optional supercapacitor for cache data power failure protection, RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration. |
| Network | (Optional) One OCP 3.0 NIC: supports two GE, two 10GE, two 25GE, or two 100GE ports; supports hot-swappable, NC-SI, WOL, and PXE. |
| PCIe Expansion | Provides up to 11 PCIe 3.0 slots, including 9 rear I/O PCIe slots, 1 internal PCIe slot, and 1 OCP 3.0-dedicated FlexIO slot |
| Heterogeneous Acceleration Cards |
Supports two dual-slot FHFL GPUs or four single-slot HHHL GPU heterogeneous accelerator cards. For details, see https://www.xfusion.com/en/ |
| Fan Modules | Six hot-swappable fan modules in N+1 redundancy mode |
| Power Supply | Two hot-swappable PSUs in 1+1 redundancy mode. Supported options include: • 3000 W AC Titanium PSUs 2500 W (input: 200 V to 220 V AC) 2900 W (input: 220 V to 230 V AC) 3000 W (input: 230 V to 240 V AC) • 2000 W AC Platinum PSUs 1800 W (input: 200 V to 220 V AC, or 192 V to 200 V DC) 2000 W (input: 220 V to 240 V AC, or 200 V to 288 V DC) • 900 W AC Platinum/Titanium PSUs (input: 100 V to 240 V AC, or 192 V to 288 V DC) • 1500 W HVDC PSUs (input: 260 V to 400 V DC, or 200 V to 277 V AC) • 1200 W DC PSUs (input: -38.4 V to -72 V DC) |
| Management | The iBMC chip integrates one dedicated GE management port to provide comprehensive management functions such as faultdiagnosis, automated O&M, and hardware security hardening. The iBMC supports standard interfaces such as Redfish, SNMP, and IPMI 2.0; provides a remote management user interface basedon HTML5/NC KVM; supports CD-free deployment and Agentless for smart and simplified management.(Optional) Configured with the FusionDirector management software to provide advanced management functions such asstateless computing, batch OS deployment, and automated firmware upgrade, enabling automatic management throughout thelifecycle. |
| Operating Systems | Microsoft Windows Server,SUSE Linux Enterprise Serve,r VMware ESX,i Red Hat Enterprise Linux,CentOS,Oracle,Ubuntu,Debian, etc. For details, see https://www.xfusion.com/en/ |
| Security Features | Supports power-on password, administrator password, Trusted Cryptography Module (TCM) /TPM 2.0, security panel, secure boot, and cover opening detection. |
| Operating Temperature | 5°C to 45°C (41°F to 113°F) (ASHRAE Class A1/A2/A3/A4 compliant) |
| Certifications | CE, UL, FCC, CCC, RoHS, etc |
| Installation Kit | Supports adjustable guide rails, holding rails, and cable management arm. |
| Dimensions (H x W x D) | 86.1 mm x 447 mm x 790 mm (3.39 in. x 17.60 in. x 31.10in.) |
Optimal Performance and High Efficiency
---Four 3rd generation Intele Xeon Scalable processors run on a 2U space. Each processor supports up to 28 computingcores. It supports Intele Turbo Boost, hyper-threading, and AVX-512, improving server processing performance through six10.4 GT/s UPI links.
---Supports Intel Deep Leaming Boost. The latest BFloat16 instruction set and vector neural network instructions (VNN) provideup to 93% higher training and 90% higher inference performance than the previous generation processors FP32.
---Supports a maximum of 48 DDR4 DIMMss of the 3200 MT/s registered DlMMss (RDIMMs) and load-reduced DIMMss(LRDIMMs). The memory capacity is up to 12 TB, meeting the requirements of large-capacity memory applications.Supports the use of 24 Optanetl PMem 200 series wth DDR4 DIMMss. The memory capacity is up to 18 TB to meet the demands of various workloads.
---Supports two dual-slot FHFL or four single-slot HHHL GPU heterogeneous accelerator cards, providing powerful computingpower for Al analysis and training scenarios.
---Supports a maximum of 25 x 2.5-inch SAS/SATA drives and 16 NVMe SSDs. Multiple storage media can be combined to achieve data tiering and ultimate performance.
---Supports boot speedup storage technology (BSST). The OS is installed on two M.2 SSDs, which is deployed separately fromservice data. Supports hardware RAID and hot swappable for M.2 SSDs.
Smart Power Saving and Better Energy Efficiency
---Adopts DEMT, driving down overall equipment power consumption by up to 15% wthout compromising worikdoad perfomancethrough multiple power-saving measures such as component hibernation, PID/DTS algorithm based fan speed tuning, andactive-standby power supplies.
---Supports 900 W, 1200 W, 1500 W, 2000 W and 3000 W PSU options, meeting various workloads and high performancerequirements.
---Supports 1500 W HVDC PSUs, improving more than 94% energy efficiency.
---Uses 80 PLUS Titanium PSUs that provide a conversion efficiency of up to 96%.
Intelligent Management and Openness for IntegrationIntegrates
---FusionDirector for intelligent full-lifecycle O&M, improving O&M efficiency by 30%.
> Intelligent maintenance integrates diagnosis and recovery, and accurately manages key components. The faut diagnosisaccuracy reaches 93% and the breakdown rate decreases by 50%
> Intelligent upgrade enables one-click automation, coud -based collaboration for quick policy formulation, and firmwareversions automatic completeness and upgrade in batches, improving efficiency by 20x.
> Intelligent discovery enables 100% accuracy of component-level visualization, automatic asset inventorying in seconds, and real-time track tracing.
>Intelligent energy saving enables refined dynamic energy management. It integrates the DEMT 20, saving 18% of the system energy.
> Inteligent deployment enables pipelined deployment and one-clicks switchover on demand, improving deploymentefficiency by 10x.
---Provides standardized open interfaces and development guides, facilitating seamless integration with third-partymanagement software.
담당자: Sandy Yang
전화 번호: 13426366826
Korean
